Form：爱集微 2018/11/19Browse：5289
According to a survey conducted by Taiwan research institutes, 5G high frequency communication chip packaging is expected to develop towards AiP technology and fan-out packaging technology in the future. It is expected t...
Form：新浪科技 2018/11/8Browse：4261
In the early morning of November 8, Beijing time, according to CNBC website, sources said that chip company Xilinx had hired Barclays Bank to help it acquire Mellanox, continuing the trend of integration in the semiconductor industry. Reported that xilinsi had contact with Mai Luo Si, launched a takeover offer for it.
Form：芯科技 2018/10/17Browse：4855
According to Nikko Industries, Japan's MLCC Major Factory, Murata, is planning to build a new factory in Okayama Prefecture at 10 billion yen ($89 million) after investing 40 billion yen to build a new plant in Shimane Prefecture late last month. The factory will be responsible for the production of ceramic materials for laminated ceramic capacitors, and Okayama and Shimane adjacent counties, may be set up for the raw materials of the Shimane plant.
Form：laoyaoba 2018/9/29Browse：4650
Leti, A Research Institute of ST and CEA Tech, announced a collaborative effort to develop silicon-based GaN power switching module manufacturing technology. The silicon-based GaN power technology will enable Italian Semiconductors to meet high-performance, high-power applications, including hybrid and electric vehicle chargers, wireless charging and servers.
Form：laoyaoba.com 2018/8/17Browse：5761
IC Design Factory Weizhuo (2436) Express IC Receiver reported that the market is breaking into Huaweis new Mate 20 supply chain, which will be launched in the fourth quarter of this year, and began to gradually increase...
Form：laoyaoba.com 2018/8/15Browse：5475
Intel unveiled the new Xeon roadmap at the data center Innovation Summit held today. In the fourth quarter of this year, Intel will update the Xeon Scalable family, code name or architecture to Cascade Lake, 14nm process. This generation will redesign memory controllers to support Optane DIMM nonvolatile memory bars, introduce DLBoost extended instruction set AVX512_VNNI with accelerated depth computing capabilities, and also defend against Spectre (ghost) and Meltdown (fuse) vulnerabilities at the hardware level.
Form：laoyaoba.com 2018/8/8Browse：7423
High Qualcomm wearable chips have not been updated for nearly two years, although Qualcomm has updated the Wear 2500 this year, but it is for children's watches, not other wearable devices. Today, Qualcomm has finally remembered to update the wider use of wearable cores.
Form：laoyaoba.com 2018/8/6Browse：5474
In order to push the animal networking strategy, IP, Kigen, Mbed OS and PSA, Arm launched the Internet of things management platform Pelion, which provides a unified security model and a single console, providing a high security and simple management platform. Arm claims that this is the first mixed environment environment for end to end Internet of things connection, data and management platform.
Form：laoyaoba.com 2018/8/6Browse：5754
Taiwan semiconductor giant TSMC suddenly encountered a large-scale virus attack.
Form：laoyaoba.com 2018/8/1Browse：6072
Set micronet news, 31 days of the United States Department of development published 2018 Q2 financial report, the executive director Rick Tsai pointed out that the second quarter of this year, the combined revenue of 60 billion 481 million NT $60 billion 481 million (the same), an increase of 21.8% compared with the previous quarter; gross interest rate is 38.2%, a 0.2 percentage point lower than the previous quarter; business interest of 4 billion 92 million yuan, an increase of 112.1% compared with the previous season; net profit of this period It was 7 billion 498 million yuan, an increase of 181.9% over the previous quarter, an increase of 239.3% over the same period last year.
